YTSK600400105 Skived fin heat sink for IGBT cooling
Heat Sinks
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Customized the skived fin heat sinks YTSK600400105
The design requirements:
Thermal power- 140W
Al1060 Skived fin +Heat pipes
Heat sink size: 120*280*75mm
Fin thickness:0.8mm
Fin distance :2.4mm
heat sink base:7.0mm
Input flow FanNOCTUA NF-F12
3000 PWM
(120x120x25mm Fan)*2pcs
Environment 28℃
The Max temperature of heat sink surface is below 50 ℃
The temperature difference of the same chip type is about 2 ℃
2. No expensive mold fee is required, usually only one profile , width and height unit size is required.
3. There is no thermal resistance between the fin and the bottom plate. Unlike the soldering paste soldering process or the epoxy bonded heat sink, there is a relatively large thermal resistance value between the bottom plate and the fin.
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