Liquid cold plate
Customized YTLCP-F20213020 efficient FSW Liquid cooled plates for IGBT module cooling
IGBT’s efficient FSW liquid cooled plate and internal water channel use skived fin process to produce micro water channel structure, which is welded by friction stir welding process, it has very efficient heat dissipation performance. CNC precision machining of overall dimensions can meet the heat dissipation requirements of IGBT with different sizes and powers. Designed to fit standard IGBT and other power electronics applications. we can also customize any of the cold plate sizes to fit into your application
PRODUCT SPECIFICATIONS
Plates Details: Extruded Aluminum 6063-T5
Skived process to make the Micro water channel
Friction stir welding process
Standard Finish: Chromate Coating
High thermal Conductivity
1/4 NPT threaded input and output
Low pressure drop
Superior heat transfer
Measurement: 202*130*20mm,1.4kg
IGBT COMPATIBILITY
Semikron SemiX® 3
Infineon EconoDUAL™3
Fuji Semiconductor Spring Contact Module
Powered NX™ Series
Thermal designing parameters
Thermal power @ 1000W
The ambient temperature is 35 °C
The flow of water 4LPM
Thermal resistance: (46.4-35)/1000=0.012
THERMAL SIMULATION ANALYSIS
